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| 型号 | 输入电压(V) | 输出电压 ( Vo±2% ) | 满载输出电流 (mA) | 效率 | 重量(g) ±0.5 | 封装 | 认证 |
| H78S3.3(T)-0.5 | 4.75~28 | 3.3VDC | 500 | ≥78% | 3.6 | SIP(SMD) | RoHS |
| H78S3.3(T)-1.0 | 4.75~28 | 3.3VDC | 1000 | ≥80% | 3.6 | SIP(SMD) | RoHS |
| H78S3.3-2.0 | 4.75~28 | 3.3VDC | 2000 | ≥91% | 3.6 | SIP | RoHS |
| H78S05(T)-0.5 | 6.5~32 | 5.0VDC | 500 | ≥80% | 3.6 | SIP(SMD) | RoHS |
| H78S05(T)-1.0 | 6.5~32 | 5.0VDC | 1000 | ≥82% | 3.6 | SIP(SMD) | RoHS |
| H78S05-2.0 | 6.5~32 | 5.0VDC | 2000 | ≥91% | 3.6 | SIP | RoHS |
| H78S09(T)-0.5 | 12~32 | 9.0VDC | 500 | ≥84% | 3.6 | SIP(SMD) | RoHS |
| H78S09(T)-1.0 | 12~32 | 9.0VDC | 1000 | ≥86% | 3.6 | SIP(SMD) | RoHS |
| H78S09-2.0 | 12~32 | 9.0VDC | 2000 | ≥91% | 3.6 | SIP | RoHS |
| H78S12(T)-0.5 | 16~32 | 12VDC | 500 | ≥80% | 3.6 | SIP(SMD) | RoHS |
| H78S12(T)-1.0 | 16~32 | 12VDC | 1000 | ≥87% | 3.6 | SIP(SMD) | RoHS |
| H78S12-2.0 | 16~32 | 12VDC | 2000 | ≥91% | 3.6 | SIP | RoHS |
| KRD05S09-XW | 4.5~9 | 9VDC | 1000 | ≥83% | 14 | DIP | RoHS |
| KRD05S09-XW | 5.5~9 | 9VDC | 2000- 3000 | ≥86% | 14 | DIP | RoHS |
| KRD09S12-XW | 6~12 | 12VDC | 1000 | ≥86% | 14 | DIP | RoHS |
| KRD09S12-XW | 6.5~12 | 12VDC | 2000- 3000 | ≥89% | 14 | DIP | RoHS |
| KRD12S24-XW | 9~24 | 24VDC | 1000 | ≥93% | 14 | DIP | RoHS |
| KRD12S24-XW | 9~24 | 24VDC | 2000- 3000 | ≥96% | 14 | DIP | RoHS |
* 上方产品参数仅供参考，详细技术参数请以技术规格书为准
·宽电压4.75VDC-32VDC输入
·效率高达93%
·外壳:高阻燃塑胶外壳、金属外壳及裸板封装
·平均时间(MTBF): 2000000h
·工作温度:-40℃～+85℃
·工作温度:85℃ ,相对温度:10%～90%
·输出电压精度±2%
·单排直插(SIP)封装，双排直插(DIP)封装
·贴片封装(SMD)
H78S_- 0.5系列(SIP) 11.60×10.00×7.55(mm)
H78S_-1.0系列(SIP) 11.50×8.90×17.50(mm)
H78S_-2.0系列(SIP) 11.50×8.90×17.50(mm)
H78S_T-0.5系列(SMD) 15.24×8.30×7.25(mm)
KRD_S_-_W系列(DIP) 48.00×36.00×22.00(mm)
KRD_S_-_W系列(DIP) 55.00×45.00×22.00(mm)
