品牌
其他厂商性质
所在地
1、整体式焊接框架;
2、多功能平台设计;
3、简洁可靠的PCB定位系统:可调PCB厚度,软件可调弹性侧压和磁性支撑装置。
4、智能刮刀系统:智能可编程设置、独立、直联马达驱动的刮刀,内置精确压力控制系统。
指数 parameter | 型号Model | T5 |
基本参数 Basic Parameters | 钢网尺寸 Screen Frame Size(mm) | 650(X)x420(Y)—850(X)x850(Y) |
厚度 Thickness : 20-40mm | ||
最小PCB尺寸(mm) Min PCB(mm) | 50(X)x50(Y)mm | |
PCB尺寸(mm) Max PCB(mm) | 510(X)x510(Y)mm | |
厚度 Thickness | 0.2mm ~ 6mm (0.4mm以Tin治具 Use jig when pcb less than 0.4mm} | |
翘曲量Curve | <1% (Diagonal measurement) | |
背部元件高度 PCB backside Part Height | 20mm | |
传输高度 Conveyor height | 900±40mm | |
Support | 磁性顶针,磁性顶块 , 真空吸腔(凝B) Magnetic support, Magnetic piece, Vacuum chamber (Option) | |
趣財Clamp | ||
板边距离Edge distance | PCB工艺边不小于2.5mm PCB process edge less than 2.5mm | |
Conveyor speed | 0*-1500mm/sec,增Klmm 0~1500mm/secjncrement 1mm | |
运输皮带类型Conveyor belt | U型同步带 U type sync belt | |
停板方式 Stopper method | Air cylinder | |
停板位置 Stopper position | ^JgPCB尺止Set the PCB stopper position according to the size of board | |
传送方向 Flow direction | 左-右、右左左-左、右-右出rWF户 L-K R-L、L-L、R-R depends on customer | |
印刷系統 Print System | 印刷速度Print speed | 5-200mm/sec可调 5-200mm/sec adjustable |
印刷头Print head | 步进马达直联驱动刮刀升憚Step motor drive scraper lifting | |
刮刀 Scraper | 钢刮刀,胶刮刀(可选)Steel scraper, rubber scraper (option) | |
刮刀角度Scraper angle | 60° | |
刮刀压力 Scraper pressure | 0~20kg | |
视觉系统 View System | Substrate Separation | 三段式脱模 Three-section Substrate Separation 速度(speed): 0.1-20mm/s 距离(distance): 0-20mm |
对式 Alignment position method | Mark点自动对准 Mark Automatic aligning | |
机 Camera | 德国Germany BASLER , 1/3" CCD , 640*4S0ftt素 pixel f 像素尺寸pixel size 5.6pmx5.6pm | |
取像方式 Acquire image method | Jz/TJERS Upper/under double photo | |
相机灯光Camera light | 同轴光环形光共4路可调 Coaxial lightning light four kinds light can adjustable | |
视野范围View range | 9mm*7mm | |
寸 Mark dimensions | 直径或边长为 1mm ~ 2mm允许偏差 10% Diameter or Side length 1mm ~ 2mmrallowable offset 10% | |
标记点形状Mark shape | 同形、方形,菱形等形状 Cir,Rec, or rhombus etc | |
标记点位置Mark position | PC嚙专用marksEPCB焊盘 PCB dedicated mark or PCB pad | |
2D检测 2D detection | 标配 Standard | |
精度JK Accuracy | 平台调圏SB Table adjusting range | X=±3mm,Y=±7mmJ 0=±1.5° |
定位隋度 Positional accuracy | ±0.01mm | |
印刷精度 Printing accuracy | ±0.025mm | |
时间 Time | 循环时间Cycle time | <10s环包含印刷,清洗时何ex print, cleaning time) |
换线时间 Convert line time | <5 分钟 <5min | |
SJfBSSSHS] Programming time | vl 吩钟 <10min | |
控制系統 Control System | 电脑配置 Computer configuration | , WindowsIEJfiMSS Industrial PC , Windows official system |
系统语盲 System language | 中、英文 Chinese、English | |
上下 Pre and next machine connection | SMEMA | |
用户权限 User authorization | 用户密码和高级密码设定User PW and Senior PW set | |
清洗系統 Cleaning System | 清洗系统 Cleaning system | 干、湿(标配),真空模式(选配)Dry and Wet(standard),vacuum model(optionaD |
液位检测 Liquid level detection | 液位自Liquid level auto alarm detection | |
功率參數 Power Parameters | 主供电源 Main power supply | AC 220V±10% 50/60HZ 单相 Single phase |
总功率 Total power | 约3kw | |
主供气源 Main air supply | 4.5~6kgf/cm2 | |
机器重量 Machine weight | 约 about950Kg | |
机器外形尺寸 Machine dimensions | 1530(L)xl680(W)xl540(H)mm | |
选配 Option | 自^Pneumatic top clamp | 用于薄(厚8《lmm ) For PCB(thickness |
固定式顶夹硕夹Top clamp + side clamp | 用于簿無板(原度Ulmm) For PCB(thickness£lmm) | |
真空吸附+真空清洗 Vacuum adsorption and dean | 用于簿电路板或软板For PCB(thicknessslmm)and FPC | |
自动顽喺膏Auto tin added | / | |
自动上下料 Auto loading and unloading | / | |
Flexible and universal support | 用于双面PCB®支撑(板下元器件高度<9mm ) For the Double-sided PCB(PCB backside parts Height < 9mm) | |
钢网自动定位 Automatic positioning of screen frame | 钢网自动定位 Automatic positioning of screen frame | |
PC瞞厚自赫蹶能 | / | |
刮刀卧反馈功能 | / | |
SiJS Air condition | 选配或者§户自行购买Customer can buy by themselves | |
®W#G3il!$SE The rest of solder paste on the stencil monitoring system | / | |
SPIOl SPI close loop | SPIK机 SRI dose loop | |
UPSBr^i^ UPS power off protection | UPS 15分钟断电<眇 UPSlSmin power off protection | |
工业4.0 Industry 4.0 | / 等 Bar code trace function , Production analysis, etc |