品牌
其他厂商性质
郑州市所在地
半导体减薄砂轮Semiconductor Thinner Grinding Wheel2
面议无心磨砂轮Centerless Grinding Wheels2
面议周边磨砂轮Periphery grinding wheels2
面议划片刀 Dicing Blade2
面议金刚石倒边轮Diamond Grinding Wheels for Edge-Grinding2
面议上压式MY系列油压机2
面议端面磨砂轮Double sides grinding wheels2
面议挤压磨料流Product Manual of Abrasive Flow3
面议金属结合剂制品系列Metal Bond Products Series2
面议金刚石微粉Synthetic Diamond Micro Powder2
面议刀架Flange2
面议刻蚀用陶瓷环Ceramic Ring for Etching2
面议主要特点
珩磨效率高
加工精度高
功耗低
Main features
High efficiency
High precision
Low power consumption
应用领域与适用范围
适用于不同材质(各种铸铁、陶瓷、铝合金及镀铬)缸套、缸套座及连杆的珩磨加工,广泛应用于汽车、摩托车、制冷、轴承、船舶、航空等领域。
型号有HMA/1、HMA/2、HMH、2HMA、HMA/S0、HA、HH 等,也可根据用户需要订做各种要求的产品。
Application
They are used for processing different materials (various cast iron, ceramic, aluminum alloy and plated chrome) cylinder sleeve, cylinder block and connecting rods. They are widely used for automotive, motorcycle, refrigeration, bearing, marine, and aviation etc.
The specifications include HMA/1、HMA/2、HMH、2HMA、HMA/S0、HA、 HH. We can make products according to customers’requirements.