品牌
其他厂商性质
郑州市所在地
半导体减薄砂轮Semiconductor Thinner Grinding Wheel2
面议无心磨砂轮Centerless Grinding Wheels2
面议周边磨砂轮Periphery grinding wheels2
面议划片刀 Dicing Blade2
面议金刚石倒边轮Diamond Grinding Wheels for Edge-Grinding2
面议上压式MY系列油压机2
面议端面磨砂轮Double sides grinding wheels2
面议挤压磨料流Product Manual of Abrasive Flow3
面议金属结合剂制品系列Metal Bond Products Series2
面议金刚石微粉Synthetic Diamond Micro Powder2
面议刀架Flange2
面议刻蚀用陶瓷环Ceramic Ring for Etching2
面议主要特点
强度高、散热性能好、磨削效率高、使用寿命高、安全性高、无需修整、改善工作环境。
Main features
High strength/Good heat dissipation/High grinding efficiency/High service life/High security/No dressing/Improve working environment
应用领域
发动机缸体缸盖、凸轮轴、曲轴、涡轮增压器壳体、液压件等铸件的飞边毛刺、模线、浇冒口等部位的打磨清理。
Application
Grinding and cleaning of flash burr, mould lines, pouring risers and other parts of castings such as engine block and cylinder head, camshaft, crankshaft, turbocharger shell, hydraulic parts etc.
适用材料
各种类型的灰铁、球铁及铸钢。
Applied material
Various types of gray iron, ductile iron and cast steel.