1

有效加热区域

Effective heating area

长250*宽250*高250

Length 250 * width 250 * height 250

mm

2

处理基板尺寸

Processing substrate size

≤250*250*250

≤Length 250 * width 250 * height 250

mm

3

工作温度

Maximum operating temperature

950

℃

4

温度

maximum temperature

1000

℃

4

均温性（900℃，保温30分钟后测量）Homogenization (900 ℃ for 30 minutes)

±5

℃

5

控温精度 control accuracy

±1

℃

6

真空度 vacuum degree

冷态极限（室温）Cold limit (room temperature)

优于 6.67 x 10^-4

^{Better than 6.67 x 10-4}

Pa

工作

（空炉，900℃，保温30min）

work

(empty furnace, 900 ℃ for 30min)

优于 6.67 x 10^-3

^{Better than 6.67 x 10-3}

Pa

7

抽气速率（1atm到6.67×10^-3Pa）

Pumping rate (1atm to 6.67 × 10-3pa)

主抽阀打开后20min之内

Within 20min after the main extraction valve is opened

/

9

压升率

Pressure rise rate

< 1

Pa/h

10

升温速率

heating rate

≤20

℃/min

11

温度测量

temperature measurement

一点控温、一点金属屏温度监控，预留电极法兰口，用于温场测量One point temperature control, one point metal screen temperature monitoring, reserved electrode flange port for temperature field measurement

/

12

均温性测量口Temperature uniformity measuring port

可带5根热电偶

With 5 thermocouples

/